The ASA Group of Companies started in 1978 as a precision engineering company manufacturing semiconductor tools and spares. Since then, the Group has strategically molded its core business towards manufacturing automation equipment for the encapsulation of semiconductors. ASA’s equipment is used in IC manufacturing processes. It also supplies machines for the back-end assembly of ICs. Today, the Group is an international manufacturer of automated backend equipment for the semiconductor assembly process. Its equipment are sold worldwide to major semiconductor manufacturers such as ST Microelectronics Group, Kemet Electronics Portugal, S.A., Global Advanced Packaging Technology, Carsem Group and Cypress Manufacturing Limited.To enhance ASA’s position in the Flip-chip arena, Advanpack Solutions Pte Ltd was formed in January 1997 to acquire infrastructure capabilities critical for the packaging shift from wirebonded package to Flip-chip. Today, the ASA Group has the capability to provide a comprehensive Flipchip solution combining APS’s technology, processes and material such as Pillar Bumping and No-Flow Underfill with ASA’s equipment.